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化学镀高Cu含量Ni-Cu-P镀层的组织结构及显微力学性能研究

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  • 1. 台州耘智科技有限公司,浙江 台州 318001,2. 台州学院,浙江 台州 318001
刘义林(1979-),学士,工程师,主要从事复合材料和机械制造研究,电话:0576-88662316,E - mail:starwq@126.com

收稿日期: 2022-02-01

  修回日期: 2022-03-01

  录用日期: 2022-03-21

  网络出版日期: 2023-12-15

基金资助

浙江省重点研发计划项目(2020C04004)资助

Study on Microstructure and Micromechanical Properties of Cu - Rich Ni - Cu - P Coating Synthesized by Electroless Plating

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  • 1. Taizhou Yunzhi Technology Limited Company, Taizhou, 318001, China;2. Taizhou University, Taizhou 318001, China

Received date: 2022-02-01

  Revised date: 2022-03-01

  Accepted date: 2022-03-21

  Online published: 2023-12-15

摘要

为了探究化学镀高Cu含量Ni - Cu - P镀层的组织结构及显微力学性能,通过化学镀法在45钢基体表面镀覆了高Cu含量的Ni - Cu - P镀层,通过扫描电镜、X射线衍射仪、EDS能谱分析仪、显微硬度计、纳米压痕仪等测试了未经热处理和经过热处理的镀层的微观组织及显微力学性能。结果表明:获得的高Cu含量Ni - Cu - P合金镀层厚度均匀,与基体结合良好;随着施镀时间的延长,镀层中Cu含量降低而Ni、P含量增加;未经热处理的镀层主要由Ni及Cu基固溶体组成,经200 ℃/2 h、300 ℃/2 h热处理后镀层相组成无明显变化,经400 ℃热处理后有NiP2、Cu3P等磷化物析出;化学镀初期(10 min),随着施镀时间的延长,镀层硬度显著增加,之后增加不明显;热处理可促进磷化物的析出,进而提高镀层硬度,经400 ℃/2 h热处理后镀层硬度显著增加。

本文引用格式

刘义林, 袁康杰, 王军华, 毛润东, 黄国波 . 化学镀高Cu含量Ni-Cu-P镀层的组织结构及显微力学性能研究[J]. 材料保护, 2022 , 55(7) : 144 -149 . DOI: 10.16577/j.issn.1001-1560.2022.0195

Abstract

In order to explore the microstructure and micromechanical properties of Cu - rich Ni - Cu - P coating synthesized through electroless plating, such coating was synthesized on the 45 steel substrate by electroless plating. The SEM, XRD, EDS, microhardness tester and nanoindenter were used to test the microstructure and micromechanical properties of the coating without heat treatment and after heat treatment. Results showed that a uniform Cu - rich Ni - Cu - P coating was obtained, which showed good adhesion with the 45 steel substrate. With the prolongation of plating time, the content of Cu in the coating decreased while the content of Ni and P increased. The coating without heat treatment was mainly composed of Cu - and Ni - based solid solutions. After a heat treatment at 200 ℃ or 300 ℃ for 2 h, the phase composition of the coating showed no obvious change. However, after a heat treatment at 400 ℃, NiP2 and Cu3P were precipitated from the coating. In the early stage of plating (10 min), the hardness of coating increased obviously with the prolonging of the plating time, but after that a sluggish increase appeared. In all, a heat treatment, especially at 400 ℃ for 2 h, could promote the precipitation of phosphide and thus increase the hardness of coating.
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