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镀锡层抗高温性能与工艺研究

  • 刘德强 ,
  • 周圣丰
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  • 1.深圳市盛元半导体有限公司,深圳 518100;
    2.暨南大学先进耐磨蚀及功能材料研究院,广东广州 510632
刘德强(1986-),硕士研究生,高级工程师,主要从事半导体材料研发,电话:13823799516,E-mail:ldqqiang@163.com

收稿日期: 2022-11-23

  修回日期: 2022-12-15

  录用日期: 2023-01-14

  网络出版日期: 2023-07-14

Study on High Temperature Resistance and Process of Tin Coating

  • LIU De-qiang ,
  • ZHOU Sheng-feng
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  • 1. Shenzhen Shengyuan Semiconductor Co., Ltd., Shenzhen 518100, China;
    2. Research Institute of Advanced Wear and Corrosion Resistance and Functional Materials, Jinan University, Guangzhou 510632, China

Received date: 2022-11-23

  Revised date: 2022-12-15

  Accepted date: 2023-01-14

  Online published: 2023-07-14

摘要

针对铜基引线框架镀锡层高温易缩锡变色及常温不耐盐水腐蚀等问题,采用了不同电镀工艺,分析了镀层显微形貌、物相结构、抗电化学腐蚀性能与力学性能。结果表明:镀锡前,对铜表面进行充分去氧化及粗化,可极大提高镀锡层结合力,有效防止高温缩锡现象;镀锡后,镀层浸泡抗高温氧化剂,可有效防止高温发黄以及提高耐盐水腐蚀性能。

本文引用格式

刘德强 , 周圣丰 . 镀锡层抗高温性能与工艺研究[J]. 材料保护, 2023 , 56(5) : 148 -152 . DOI: 10.16577/j.issn.1001-1560.2023.0118

Abstract

Aiming at the problems such as high temperature shrinkage and discoloration of tin plating on copper-based lead frames, as well as poor resistance to salt water corrosion at room temperature, different electroplating processes were used to analyse the microstructure, phase structure, electrochemical corrosion resistance, and mechanical properties of the coating. Results showed that the sufficient deoxidation and coarsening of copper surface before tin-plating could significantly improve the bonding strength of tin-plating and effectively prevent the tin-shrinkage phenomenon at high temperature. After tin plating, soaking the coating in anti-high-temperature oxidant solution could effectively prevent yellowing at high temperature and improve the corrosion resistance in salt-water.

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