库尔勒土壤模拟液中木质素磺酸钙对纯铜接地材料的缓蚀及吸附行为研究

何成, 王宗江, 刘永强, 刘光明, 何华林, 杨海涛

doi:10.16577/j.issn.1001-1560.2024.0037

材料保护 >

2024 , Vol. 57 >Issue 2: 84 - 91

DOI: https://doi.org/10.16577/j.issn.1001-1560.2024.0037

研究篇

库尔勒土壤模拟液中木质素磺酸钙对纯铜接地材料的缓蚀及吸附行为研究

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¹国网新疆电力有限公司电力科学研究院； ²南昌航空大学材料科学与工程学院； ³成都诺嘉伟业科技有限公司

刘光明，教授，研究方向为材料腐蚀与防护，E-mail:gemliu＠126.com

收稿日期: 2023-04-28

修回日期: 2023-06-18

录用日期: 2023-06-26

网络出版日期: 2024-03-08

基金资助

国网新疆电力有限公司科技资助项目(5230DK21N001)

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Study on Corrosion Inhibition and Adsorption Behavior of Calcium Lignosulfonate on Pure Copper Grounding Material in Korla Soil Simulated Solution

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(1.State Grid Xinjiang Electric Power Co.， Ltd.， Electric Power Research Institute， Urumqi 830011， China；2.School of Material Science and Engineering， Nanchang Hangkong University， Nanchang 330063， China；3.Chengdu GREAT NORGA Science and Technology Co.， Ltd.， Chengdu 611330， China)

LIU Guangming， Professor， Research Focus: Corrosion and Protection of Materials， E-mail:gemliu＠126.com

Received date: 2023-04-28

Revised date: 2023-06-18

Accepted date: 2023-06-26

Online published: 2024-03-08

Supported by

Science and Technology Project of State Grid Xinjiang Electric Power Company(5230DK21N001)

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摘要

为了探究库尔勒土壤模拟液中添加木质素磺酸钙，对纯铜接地材料的缓蚀效率及其在纯铜接地材料表面的吸附行为，采用动电位极化曲线和电化学阻抗谱研究了库尔勒土壤模拟液中木质素磺酸钙(CLS)对纯铜接地材料腐蚀行为的影响。结果表明，当CLS 浓度在(2.27～9.08)×10-4 mol/L 范围增加时对Cu 的缓蚀效率逐渐增大，表明添加CLS 可有效抑制Cu 的腐蚀反应过程，该土壤模拟溶液体系中CLS 属于一种阳极缓蚀剂。 Mott-schottky曲线分析结果表明，土壤模拟液中Cu 表面形成的膜具有P 型半导体膜性质，且CLS 浓度在(2.27 ～9.08)×10-4 mol/L 范围增加时NA浓度降低，Cu 表面形成的半导体保护膜具有更佳的保护性。采用3 种等温吸附曲线的拟合结果表明，CLS 缓蚀剂分子在Cu 表面的吸附更倾向Langmuir 模型，在2.27×10-4 ～9.08×10-4 mol/L 的浓度范围内CLS 在Cu 表面的ΔGm值介于-37.00～-20.00 kJ/mol 之间，表明CLS 在Cu 表面是由物理吸附和化学吸附共同控制的混合吸附过程。

关键词： 库尔勒土壤模拟溶液; 纯铜接地材料; 木质素磺酸钙; 缓蚀; 吸附

本文引用格式

何成, 王宗江, 刘永强, 刘光明, 何华林, 杨海涛 . 库尔勒土壤模拟液中木质素磺酸钙对纯铜接地材料的缓蚀及吸附行为研究[J]. 材料保护, 2024 , 57(2) : 84 -91 . DOI: 10.16577/j.issn.1001-1560.2024.0037

Abstract

In order to investigate the corrosion inhibition efficiency of calcium lignosulfonate (CLS) added to the Korla soil simulation solution on pure copper grounding material and its adsorption behavior on the surface of pure copper grounding material， the effect of CLS in the Korla soil simulation solution on the corrosion behavior of pure copper grounding material was studied using potentiodynamic polarization curves and electrochemical impedance spectroscopy.Results showed that as the concentration of CLS increased within the range of 2.27×10-4 to 9.08×10-4 mol/L， the corrosion inhibition efficiency of Cu was found to gradually increase.This increase suggested that the addition of CLS effectively inhibited the corrosion reaction process of Cu， categorizing CLS in the soil simulation solution system as an anode corrosion inhibitor.Analysis of the Mott-Schottky curves revealed that the film formed on the Cu surface in the soil simulating solution possessed the characteristics of a P-type semiconductor film.It was also observed that as the concentration of CLS increased within the range of 2.27×10-4 to 9.08×10-4 mol/L，the concentration of NA decreased， enhancing the protectiveness of the semiconductor protective film on the Cu surface.Additionally， the fitting of the three adsorption isotherms demonstrated that the adsorption of CLS inhibitor molecules on the Cu surface tended more towards the Langmuir model.In the concentration range of 2.27×10-4 to 9.08×10-4 mol/L， the ΔGm values of CLS on Cu surface varied from -37.00 to -20.00 kJ/mol， indicating that the adsorption of CLS on the Cu surface was a mixed process， controlled by both physical and chemical adsorption.

Key words： Korla soil simulation solution; pure Cu grounding material; calcium lignosulfonate; corrosion inhibition; adsorption

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