冷喷涂铜颗粒沉积过程及残余应力的数值研究
收稿日期: 2023-11-06
修回日期: 2023-12-13
录用日期: 2023-12-25
网络出版日期: 2024-05-31
基金资助
国家十四五重点研发计划(2021YFB3702003,2021YFB3702002);季华实验室自主立项项目(X190391TJ190)
Numerical Study of Copper Particle Deposition Process and Residual Stress During Cold Spraying
Received date: 2023-11-06
Revised date: 2023-12-13
Accepted date: 2023-12-25
Online published: 2024-05-31
Supported by
The National 14th Five - Year Research and Development Plan ( 2021YFB3702003,2021YFB3702002);Jihua Laboratory Independently the Project (X190391TJ190)
何超, 刘灿森, 孙澄川, 卢静, 邓碧欣 . 冷喷涂铜颗粒沉积过程及残余应力的数值研究[J]. 材料保护, 2024 , 57(5) : 1 -9 . DOI: 10.16577/j.issn.1001-1560.2024.0095
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