添加不同含量Ga对新型SnInAg无铅焊料合金耐酸碱性的影响研究

任鹏凯, 徐冬霞, 曹福磊, 褚亚东, 张红霞

doi:10.16577/j.issn.1001-1560.2024.0098

材料保护 >

2024 , Vol. 57 >Issue 5: 25 - 32

DOI: https://doi.org/10.16577/j.issn.1001-1560.2024.0098

研究篇

添加不同含量Ga对新型SnInAg无铅焊料合金耐酸碱性的影响研究

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(1. 河南理工大学材料科学与工程学院，河南焦作 454003；2. 河南省结构功能性金属基复合材料工程技术研究中心，河南焦作 454003；3. 宁波博威合金材料股份有限公司，浙江宁波 315000；4. 洛阳兰迪玻璃机器股份有限公司，河南洛阳 471000)

徐冬霞，博士，副教授，主要研究方向为电子封装材料，E-mail:xudongxia@ hpu.edu.cn

收稿日期: 2023-09-28

修回日期: 2023-12-02

录用日期: 2023-12-20

网络出版日期: 2024-05-31

基金资助

河南省产学研合作项目(真空玻璃低温密封钎焊材料及关键技术研究- 152107000077)

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Effect of Different Ga Contents on the Acid and Alkaline Resistance of New SnInAg Lead-Free Solder Alloy

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(1. School of Materials Science and Engineering，Henan Polytechnic University，Jiaozuo 454003，China；2. Engineering Research Center for Structural and Functional Metal Matrix Composites in Henan Province，Jiaozuo 454003，China；3. Ningbo Boway Alloy Material Co.，Ltd.，Ningbo 315000，China；4. Luoyang LandGlass Machinery Co.，Ltd.，Luoyang 471000，China)

XU Dongxia，Ph.D.，Associate Professor，Research Focus: Electronic Packaging Materials，E-mail: xudongxia@hpu.edu.cn26

Received date: 2023-09-28

Revised date: 2023-12-02

Accepted date: 2023-12-20

Online published: 2024-05-31

Supported by

Industry -Academic -Research Cooperation Projects of Henan Province (Research of Solders and Key Technology for Sealing Vacuum Glass in Low Temperature - 152107000077)

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摘要

为改进Sn-11In-1.5Ag无铅焊料合金焊料的耐蚀性，采用失重法和电化学实验研究了Sn-11In-1.5Ag-xGa(x=0,0.1,0.3,0.5,0.7,质量分数，%)焊料合金在腐蚀环境中的腐蚀行为。利用扫描电镜(SEM)观察Sn-11In-1.5Ag-xGa焊料合金的表面形貌，利用X射线衍射仪(XRD)对焊料表面的腐蚀产物进行表征。结果表明：无论是在酸性还是碱性溶液中，添加的Ga均能提高Sn-11In-1.5Ag焊料合金的耐蚀性。随Ga含量的增加，焊料的耐蚀性也随之增强。对于相同成分的焊料合金，其耐蚀性在碱性溶液中优于酸性溶液。SEM观察表明，在Sn-11In-1.5Ag合金中加入Ga可以明显减轻焊料的腐蚀程度。XRD分析表明，焊料合金在酸性和碱性溶液中的腐蚀产物均为In₂O₃。

关键词： 无铅焊料; Sn -In -Ag 合金; Ga; 耐蚀性

本文引用格式

任鹏凯, 徐冬霞, 曹福磊, 褚亚东, 张红霞 . 添加不同含量Ga对新型SnInAg无铅焊料合金耐酸碱性的影响研究[J]. 材料保护, 2024 , 57(5) : 25 -32 . DOI: 10.16577/j.issn.1001-1560.2024.0098

Abstract

In order to improve the corrosion resistance of Sn-11In-1.5Ag lead-free solder alloy solder, the corrosion behavior of Sn-11In-1.5Ag-xGa(x=0, 0.1, 0.3, 0.5, 0.7, mass fraction, %) solder alloy in a corrosive environment was studied by weight loss method and electrochemical experiments. In addition, the surface morphologies of Sn-11in-1.5Ag-xGa solder alloy were observed by scanning electron microscopy(SEM), and the corrosion products on the solder surface were characterized by X-ray diffraction(XRD). Results showed that whether in acidic or alkaline solutions, the addition of Ga could improve the corrosion resistance of Sn-11In-1.5Ag solder alloy. With the increase of Ga content, the corrosion resistance of solder was enhanced. For solder alloys with the same composition, their corrosion resistance in alkaline solution was better than that in acid solution. Besides, SEM observation showed that adding Ga into Sn-11In-1.5Ag alloy could significantly reduce the corrosion degree of solder, and XRD analysis disclosed that the corrosion products of solder alloys in acidic and alkaline solutions were the same, both of which were In₂O₃.

Key words： lead -free solder; Sn -In -Ag alloy; Ga; corrosion resistance

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