冷喷涂铜颗粒沉积过程及残余应力的数值研究
何超, 刘灿森, 孙澄川, 卢静, 邓碧欣
Numerical Study of Copper Particle Deposition Process and Residual Stress During Cold Spraying
HE Chao, LIU Cansen, SUN Chengchuan, LU Jing, DENG Bixin
材料保护
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2024, (5): 1
-9
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DOI: 10.16577/j.issn.1001-1560.2024.0095