为了揭示在复合添加剂影响下铜电沉积的作用机理，通过线性扫描伏安(LSV)曲线和计时电流(CA)曲线研究了添加剂N，N - 二乙基硫脲、聚乙二醇(PEG)和Cl-共存时对铜沉积的影响，同时结合Tafel曲线判断了铜镀层的耐腐蚀性能，并通过SEM表征了铜镀层的微观形貌。试验结果表明：N，N - 二乙基硫脲和PEG可以增大阴极极化、成核数密度和镀层的耐蚀性并减小Cu2+的扩散系数，Cl-主要在复合添加剂中起协同作用。10 mg/L N，N - 二乙基硫脲、10 mg/L PEG和25 mg/L Cl-协同作用时成核方式始终为瞬时成核，成核数密度达到峰值2.816×106 cm-2，可得到平整细致的电解铜箔。
杜荣斌, 刘励昀, 吴夏, 刘涛, 陈杨, 陆冰沪
. 添加剂N, N - 二乙基硫脲, PEG, Cl-对高抗拉电解铜箔电结晶行为的影响[J]. 材料保护, 2021
, 54(4)
: 7
-14
.
DOI: 10.16577/j.cnki.42-1215/tb.2021.04.002
For revealing the influence mechanism of composite additives on the copper electrodeposition, the cooperation effects of additives N, N - diethylthiourea, PEG and Cl- on the deposition of copper were studied by linear sweep voltammetry (LSV) and chronoamperometry (CA) curves. Meanwhile, the corrosion resistance of copper plating was judged by Tafel curves, and the morphology of the copper coating was characterized by SEM. Results showed that N, N - diethylthiourea and PEG alone could increase the cathode polarization, nucleation number density and corrosion resistance of the coating and reduce the Cu2+ diffusion coefficient, while the presence of Cl- mainly played a synergistic role in the composite additive. Under the cooperation effects of 10 mg/L N, N - diethylthiourea, 10 mg/L PEG, and 25 mg/L Cl-, the nucleation mode was always instantaneous nucleation, and the nucleation number density reached a peak value of 2.816×106 cm-2, which could obtain fine and smooth electrolytic copper foils.
