化学镀镍反应中止问题原因分析
收稿日期: 2023-04-20
修回日期: 2023-05-20
录用日期: 2023-06-15
网络出版日期: 2023-10-15
Analysis of the Causes for Interruption in Electroless Nickel Plating Reactions
Received date: 2023-04-20
Revised date: 2023-05-20
Accepted date: 2023-06-15
Online published: 2023-10-15
张建, 王建 . 化学镀镍反应中止问题原因分析[J]. 材料保护, 2023 , 56(10) : 230 -232 . DOI: 10.16577/j.issn.1001-1560.2023.0255
[1] 廖西平,夏洪均.化学镀镍技术及其工业应用[J].重庆工商大学学报:自然科学版,2009,26(4):399-402.LIAO X P,XIA H J.Analysis of the technology of electroless nickel plating and its application in industries[J].Journal of Chongqing Technology and Business University(Natural Science Edition),2009,26(4):399-402.
[2] 谢洪波,江 冰,陈华三,等.化学镀镍规律及机理探讨[J].电镀与精饰,2012,34(2):26-30.XIE H B,JIANG B,CHEN H S,et al.Discussion on the mechanism of electroless nickel plating[J].Plating and Finishing,2012,34(2):26-30.
[3] 王美媛,旷亚非.次亚磷酸钠体系化学镀镍的研究进展[J].腐蚀与防护,1999,20(12):534-535.WANG M Y,KUANG Y F.The progress in research of electroless nickel eposition in sodium hypophosphite bath[J].Corrosion and Protection,1999,20(12):534-535.
[4] 陈月华,刘永永,江德凤,等.化学镀镍施镀过程稳定性分析[J].表面技术,2013,42(2):74-76.CHEN Y H,LIU Y Y,JIANG D F,et al.Evaluation on plating stability in electroless nickel deposition[J].Surface Technology,2013,42(2):74-76.
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