铜合金表面激光熔覆技术的研究现状

杨杰, 贺春林, 孙宇海漩, 池坪礁, 杨锡芃, 于济豪, 宋贵宏

doi:10.16577/j.issn.1001-1560.2022.0321

材料保护 >

2022 , Vol. 55 >Issue 11: 133 - 141

DOI: https://doi.org/10.16577/j.issn.1001-1560.2022.0321

综述

铜合金表面激光熔覆技术的研究现状

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¹沈阳大学辽宁省先进材料制备技术重点实验室； ²沈阳工业大学材料科学与工程学院

贺春林(1964-)，博士，教授，主要研究方向为材料腐蚀与防护，电话：024-62266139，E - mail：ccllhhe@126.com

收稿日期: 2021-07-14

修回日期: 2022-08-15

录用日期: 2022-09-06

网络出版日期: 2023-12-26

基金资助

国家自然科学基金(51171118，51772193)；辽宁省重点研发计划(2020JH210100011)资助

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Research Status of Laser Cladding Technology on the Surface of Copper Alloy

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(1. Liaoning Provincial Key Laboratory of Advanced Materials, Shenyang University, Shenyang 110044, China;2. School of Materials Science and Technology, Shenyang University of Technology, Shenyang 110870, China)

Received date: 2021-07-14

Revised date: 2022-08-15

Accepted date: 2022-09-06

Online published: 2023-12-26

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摘要

激光熔覆具有能量密度高、热影响区小、熔覆层与基体冶金结合、熔覆层组织致密、晶粒细小及性能优异等特点，被广泛应用于铜合金的表面强化。简要介绍了铜合金的性能以及激光熔覆技术对铜合金进行表面改性的优势，重点综述了制备工艺和熔覆层粉末体系对铜合金表面熔覆层的形貌、组织以及性能的影响，总结了铜合金激光熔覆的应用，并对今后的研究方向进行了展望。

关键词： 铜合金; 激光熔覆; 制备工艺; 微观结构; 性能

本文引用格式

杨杰, 贺春林, 孙宇海漩, 池坪礁, 杨锡芃, 于济豪, 宋贵宏 . 铜合金表面激光熔覆技术的研究现状[J]. 材料保护, 2022 , 55(11) : 133 -141 . DOI: 10.16577/j.issn.1001-1560.2022.0321

Abstract

Laser cladding has the characteristics of high energy density, small heat - affected zone, metallurgical bonding between the cladding layer and the substrate, compact cladding layer structure, fine grains and excellent performance. It is widely used in the surface strengthening of copper alloys. In this paper, the properties of copper alloys and the advantages of laser cladding technology in surface modification of copper alloys were briefly introduced. The effects of the preparation process as well as the powder system on the morphology, structure and performance of the cladding layer on the surface of copper alloy were emphatically reviewed. Besides, the application of laser cladding of copper alloy was summarized. Finally, the future research direction was prospected.

Key words： copper alloy; laser cladding; preparation process; microstructure; property

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