铝基碳化硅复合材料表面镀金前处理工艺探讨

侯文斌, 彭勇, 殷金周, 冯银雪

doi:10.16577/j.issn.1001-1560.2024.0022

材料保护 >

2024 , Vol. 57 >Issue 1: 177 - 180

DOI: https://doi.org/10.16577/j.issn.1001-1560.2024.0022

工艺篇

铝基碳化硅复合材料表面镀金前处理工艺探讨

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航天南湖电子信息技术股份有限公司

侯文斌，工程师，硕士研究生，主要从事金属表面处理及特种材料表面镀覆工艺技术研究，E-mail:710172647＠qq.com

收稿日期: 2023-03-29

修回日期: 2023-05-08

录用日期: 2023-05-20

网络出版日期: 2024-01-30

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Study on Pre-Treatment Processes for Gold Plating on Surface of Al-SiC Composite Materials

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(Aerospace Nanhu Electronic Information Technology Co.，Ltd.，Jingzhou 434000，China)

HOU Wenbin，Engineer，Master，Research Focus: Metal Surface Treatment and Special Materials Surface Plating Technology，E-mail:710172647＠qq.com

Received date: 2023-03-29

Revised date: 2023-05-08

Accepted date: 2023-05-20

Online published: 2024-01-30

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摘要

为在铝基碳化硅复合材料表面制备结合力和可焊性良好的金镀层，通过对前处理和材料表面金属化工艺探索试验，确定了在洁净的活化基材表面直接采用敏化和活化来实现铝基碳化硅材料表面异种元素自催化中心原子的均一性，再以硫酸镍体系进行化学镍沉积，最后通过电镀金在基材表面形成均匀、致密的镀金层。采用扫描电子显微镜对镀层截面和表面形貌进行分析，结果表明镀金层表面颜色均匀，镀层厚度均匀连续且结合力良好，说明了该工艺方法的可行性和合理性，对后续铝基碳化硅镀金生产具有较强的指导意义。

关键词： 铝基碳化硅; 金镀层; 结合力; 可焊性

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侯文斌, 彭勇, 殷金周, 冯银雪 . 铝基碳化硅复合材料表面镀金前处理工艺探讨[J]. 材料保护, 2024 , 57(1) : 177 -180 . DOI: 10.16577/j.issn.1001-1560.2024.0022

Abstract

To prepare a gold plating layer with good bonding strength and weldability on the surface of Al-SiC composite materials，experiments exploring pre-treatment and surface metallization processes of materials were conducted.It was determined that using sensitization and activation directly on a clean，activated surface of substrate could achieve uniformity of heteroatomic autocatalytic center atoms on the surface of Al-SiC materials.Subsequent chemical nickel deposition was performed using a nickel sulfate system，followed by electroplating gold to form a uniform and dense gold plating layer on the substrate surface.The coating’s cross-section and surface morphology were analyzed using scanning electron microscopy (SEM).Results showed that the surface of the gold layer was uniformly colored，with uniform，continuous thickness and good bonding strength，demonstrating the feasibility and rationality of this process method.This study had significant implications for guiding subsequent gold plating production on Al-SiC materials.

Key words： Al-SiC; gold plating layer; bonding strength; weldability

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