添加剂对Ch Cl-Gl A低共熔溶剂中电沉积铜的影响
收稿日期: 2024-05-15
修回日期: 2024-06-28
网络出版日期: 2025-01-14
Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent
Received date: 2024-05-15
Revised date: 2024-06-28
Online published: 2025-01-14
刘洋, 郝建军, 尹鸿鹍, 王薪惠 . 添加剂对Ch Cl-Gl A低共熔溶剂中电沉积铜的影响[J]. 材料保护, 2024 , 57(12) : 8 -16 . DOI: 10.16577/j.issn.1001-1560.2024.0265
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