A BGA Solder Ball Surface Treatment Agent and Its Performance Evaluation

doi:10.16577/j.cnki.42-1215/tb.2021.10.015

FANG Shu, ZHU Jun - nan, TAN Run - qiu, HUANG Jin - xin

Materials Protection ›› 2021, Vol. 54 ›› Issue (10) : 78.

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Materials Protection ›› 2021, Vol. 54 ›› Issue (10) : 78. DOI: 10.16577/j.cnki.42-1215/tb.2021.10.015

A BGA Solder Ball Surface Treatment Agent and Its Performance Evaluation

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 54(10): 78 https://doi.org/10.16577/j.cnki.42-1215/tb.2021.10.015

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