Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials

doi:10.16577/j.cnki.42-1215/tb.2021.10.022

WANG Hong, WU Ying, LIAO Bo - kai, GUO Xing - peng

Materials Protection ›› 2021, Vol. 54 ›› Issue (10) : 117.

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Materials Protection ›› 2021, Vol. 54 ›› Issue (10) : 117. DOI: 10.16577/j.cnki.42-1215/tb.2021.10.022

Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 54(10): 117 https://doi.org/10.16577/j.cnki.42-1215/tb.2021.10.022

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