Influence of Additives on Parameter Optimization and Structure of Vaccum Evaporation Copper Plating Layer of PCB Epoxy Resin Board for Sensor

doi:10.16577/j.issn.1001-1560.2022.0020

CHEN Wei - guang, LIU Juan

Materials Protection ›› 2022, Vol. 55 ›› Issue (1) : 159-164.

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Materials Protection ›› 2022, Vol. 55 ›› Issue (1) : 159-164. DOI: 10.16577/j.issn.1001-1560.2022.0020

Influence of Additives on Parameter Optimization and Structure of Vaccum Evaporation Copper Plating Layer of PCB Epoxy Resin Board for Sensor

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 55(1): 159-164 https://doi.org/10.16577/j.issn.1001-1560.2022.0020

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