Numerical Study of Copper Particle Deposition Process and Residual Stress During Cold Spraying

doi:10.16577/j.issn.1001-1560.2024.0095

HE Chao, LIU Cansen, SUN Chengchuan, LU Jing, DENG Bixin

Materials Protection ›› 2024, Vol. 57 ›› Issue (5) : 1-9.

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Materials Protection ›› 2024, Vol. 57 ›› Issue (5) : 1-9. DOI: 10.16577/j.issn.1001-1560.2024.0095

Numerical Study of Copper Particle Deposition Process and Residual Stress During Cold Spraying

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 57(5): 1-9 https://doi.org/10.16577/j.issn.1001-1560.2024.0095

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