Comparative Study on the Performance of HEDP Copper Plating and Cyanide Copper Plating Processes

doi:10.16577/j.issn.1001-1560.2024.0194

MU Juanjuan, DI Xiaogang, WEN Quan, REN Shouwei, WANG Zhigao

Materials Protection ›› 2024, Vol. 57 ›› Issue (8) : 206-213.

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Materials Protection ›› 2024, Vol. 57 ›› Issue (8) : 206-213. DOI: 10.16577/j.issn.1001-1560.2024.0194

Comparative Study on the Performance of HEDP Copper Plating and Cyanide Copper Plating Processes

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 57(8): 206-213 https://doi.org/10.16577/j.issn.1001-1560.2024.0194

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