Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent

doi:10.16577/j.issn.1001-1560.2024.0265

LIU Yang, HAO Jianjun, YIN Hongkun, WANG Xinhui

Materials Protection ›› 2024, Vol. 57 ›› Issue (12) : 8-16.

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Materials Protection ›› 2024, Vol. 57 ›› Issue (12) : 8-16. DOI: 10.16577/j.issn.1001-1560.2024.0265

Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 57(12): 8-16 https://doi.org/10.16577/j.issn.1001-1560.2024.0265

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