In order to improve the stability of electroless palladium plating on print circuit boards, the effect of stabilizers on the stability of the plating solution, the plating speed, the morphology of the coating and nickel corrosion after gold plating were studied by plating solution stability test, film thickness test, scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). Results showed that in the acrylic acid range of 0.050～0.300 mol/L, the deposition rate of electroless palladium plating was generally decreased with the increasing concentration of acrylic acid. At the same time, when the concentration of inorganic salt C was 1.000～7.000 mg/L, the stability of plating solution could be greatly improved, and the deposition rate decreased with the increase of content. With 0.300 mg/L acrylic acid and 1.000 mg/L inorganic salt, the plating solution showed good stability and stable palladium deposition rate. The obtained palladium coating was uniform and compact, which could inhibit nickel corrosion effectively during the gold plating.
