For revealing the influence mechanism of composite additives on the copper electrodeposition, the cooperation effects of additives N, N - diethylthiourea, PEG and Cl- on the deposition of copper were studied by linear sweep voltammetry (LSV) and chronoamperometry (CA) curves. Meanwhile, the corrosion resistance of copper plating was judged by Tafel curves, and the morphology of the copper coating was characterized by SEM. Results showed that N, N - diethylthiourea and PEG alone could increase the cathode polarization, nucleation number density and corrosion resistance of the coating and reduce the Cu2+ diffusion coefficient, while the presence of Cl- mainly played a synergistic role in the composite additive. Under the cooperation effects of 10 mg/L N, N - diethylthiourea, 10 mg/L PEG, and 25 mg/L Cl-, the nucleation mode was always instantaneous nucleation, and the nucleation number density reached a peak value of 2.816×106 cm-2, which could obtain fine and smooth electrolytic copper foils.
DU Rong - bin, LIU Li - yun, WU Xia, LIU Tao, CHEN Yang, LU Bin - hu
. Effects of Additives N, N - Diethylthiourea, PEG and Cl- on the Electro - Crystallization Behaviors of High Tensile Electrolytic Copper Foils[J]. Materials Protection, 2021
, 54(4)
: 7
-14
.
DOI: 10.16577/j.cnki.42-1215/tb.2021.04.002
