Preparation and Properties of High-Volume-Fraction SiC Reinforced Copper Matrix Composites

ZHANG Qiang, YANG Chenggang, YAO Bo, WU Jisi, QIAN Wen

doi:10.16577/j.issn.1001-1560.2022.0350

Materials Protection >

2022 , Vol. 55 >Issue 12: 125 - 131

DOI: https://doi.org/10.16577/j.issn.1001-1560.2022.0350

Preparation and Properties of High-Volume-Fraction SiC Reinforced Copper Matrix Composites

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(1. School of Aeronautical Manufacturing Engineering， Nanchang Hangkong University， Nanchang 330063， China；2. Department of Aeronautical Mechanical Engineering， Chinese People’s Liberation Army Aviation School， Beijing 101123， China)

Received date: 2022-06-01

Revised date: 2022-07-12

Accepted date: 2022-08-03

Online published: 2023-12-27

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Abstract

With the rapid development of modern industry， SiC/Cu composites have great application prospect in electronic packaging due to their excellent conductivity， high strength and thermal conductivity. In this paper， high-volume-fraction β-Sic＠Cu/Cu composites were successfully prepared by electroless plating and powder metallurgy method， and their phase， microstructure and thermal expansion coefficient were characterized by metallographic microscope， XRD and SEM. Results showed that with the increase of SiC volume fraction， the density and flexural strength of β-SiC＠Cu/Cu composites decreased， while the hardness of the composites increased. Moreover， the flexural strength of β-SiC＠Cu/Cu composites was over 70 MPa， the thermal expansion coefficient was 4.5×10-6～10.0×10-6/℃， which met the performance requirements of modern electronic packaging materials.

Key words： SiC; copper matrix composite; electroless plating; metallurgical powder; flexural strength; thermal expansion coefficient

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ZHANG Qiang, YANG Chenggang, YAO Bo, WU Jisi, QIAN Wen . Preparation and Properties of High-Volume-Fraction SiC Reinforced Copper Matrix Composites[J]. Materials Protection, 2022 , 55(12) : 125 -131 . DOI: 10.16577/j.issn.1001-1560.2022.0350

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