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Study on Preparation and Properties of Ni - P Electroless Coating on Surface of Copper Alloy for Architectural Decoration

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  • Zhejiang Industry Polytechnic College, Shaoxing 312000, China

Received date: 2021-10-26

  Revised date: 2021-11-30

  Accepted date: 2021-12-27

  Online published: 2023-12-28

Abstract

In order to increase the wear resistance of copper alloy for architectural decoration, the effects of hard phase TiN concentration and heat treatment on the microstructure, phase composition, hardness and wear resistance of Ni-P electroless coating on copper alloy were studied. Results showed that the decorative copper alloy substrate was mainly composed of CuZn phase and CuZn5 phase, and the amorphous steamed bread peak of Ni and diffraction peak of CuZn could be seen on the surface of electroless coating. The microhardness of the electroless coating was higher than that of copper alloy substrate, and the microhardness of the electroless coating increased with the increase of TiN concentration. When the concentration of TiN was 3~11 g/L, the wear rate of the electroless coating was lower than that of the copper alloy substrate, the wear rate of the electroless coating was the lowest [1.15×10-8 g/(r·N)] when the TiN concentration was 7 g/L, and the wear mechanism was oxidation wear. After the heat treatment at 300~ 600 ℃, the electroless Cu-P-TiN coating was crystallized and formed Ni and Ni3P phases. With the increase of heat treatment temperature, the microhardness of the electroless coating first increased and then decreased, and the wear rate first decreased and then increased. When the heat treatment temperature was 400 ℃, the maximum hardness and minimum wear rate were obtained, indicated that the heat treatment would be helpful to improve the wear resistance of the electroless coating.

Cite this article

XU Wen-can . Study on Preparation and Properties of Ni - P Electroless Coating on Surface of Copper Alloy for Architectural Decoration[J]. Materials Protection, 2022 , 55(4) : 104 -110 . DOI: 10.16577/j.issn.1001-1560.2022.0102

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