Study on Pre-Treatment Processes for Gold Plating on Surface of Al-SiC Composite Materials

HOU Wenbin, PENG Yong, YIN Jinzhou, FENG Yinxue

doi:10.16577/j.issn.1001-1560.2024.0022

Materials Protection >

2024 , Vol. 57 >Issue 1: 177 - 180

DOI: https://doi.org/10.16577/j.issn.1001-1560.2024.0022

Study on Pre-Treatment Processes for Gold Plating on Surface of Al-SiC Composite Materials

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(Aerospace Nanhu Electronic Information Technology Co.，Ltd.，Jingzhou 434000，China)

HOU Wenbin，Engineer，Master，Research Focus: Metal Surface Treatment and Special Materials Surface Plating Technology，E-mail:710172647＠qq.com

Received date: 2023-03-29

Revised date: 2023-05-08

Accepted date: 2023-05-20

Online published: 2024-01-30

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Abstract

To prepare a gold plating layer with good bonding strength and weldability on the surface of Al-SiC composite materials，experiments exploring pre-treatment and surface metallization processes of materials were conducted.It was determined that using sensitization and activation directly on a clean，activated surface of substrate could achieve uniformity of heteroatomic autocatalytic center atoms on the surface of Al-SiC materials.Subsequent chemical nickel deposition was performed using a nickel sulfate system，followed by electroplating gold to form a uniform and dense gold plating layer on the substrate surface.The coating’s cross-section and surface morphology were analyzed using scanning electron microscopy (SEM).Results showed that the surface of the gold layer was uniformly colored，with uniform，continuous thickness and good bonding strength，demonstrating the feasibility and rationality of this process method.This study had significant implications for guiding subsequent gold plating production on Al-SiC materials.

Key words： Al-SiC; gold plating layer; bonding strength; weldability

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HOU Wenbin, PENG Yong, YIN Jinzhou, FENG Yinxue . Study on Pre-Treatment Processes for Gold Plating on Surface of Al-SiC Composite Materials[J]. Materials Protection, 2024 , 57(1) : 177 -180 . DOI: 10.16577/j.issn.1001-1560.2024.0022

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